Senior ASIC Package Design Engineer

3 weeks, 4 days ago
Full-time
Senior
IoT and Embedded Systems

K2 Space Corporation

K2 Space builds high-powered satellite platforms and satellite buses for missions across LEO, MEO, and GEO, emphasizing higher payload power, large payload mass, vertical integration, and in-house manufacturing.

Defense and Space Manufacturing
51-200
Founded 2022
$180M raised

Description

  • Define FC-BGA and MCM package architectures, including substrate stack-ups, ball maps, power delivery, signal breakout, and mechanical constraints.
  • Lead trade studies spanning cost, performance, signal integrity, power integrity, thermal performance, manufacturability, and reliability.
  • Establish package design standards, methodologies, and best practices.
  • Drive detailed package design for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signals.
  • Define and review via strategies, impedance control, escape routing, and reference-plane planning.
  • Collaborate with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
  • Develop package-level SI/PI strategies, including PDN design and decoupling.
  • Lead package thermal architecture, including lids, TIMs, heat spreaders, and cooling interfaces.
  • Manage OSAT, packaging vendor, and substrate supplier relationships.
  • Drive material selection, substrate technology decisions, and assembly process optimization.

Requirements

  • Bachelor’s degree in Packaging, Mechanical, Electrical Engineering, or a related field.
  • 5+ years of ASIC package design experience with deep FC-BGA expertise.
  • Experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong knowledge of substrate technologies, materials, package-level SI/PI, and thermal management for power-dense ASICs.
  • Proficiency with SI/PI and electromagnetic simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies.
  • Experience with MCM or heterogeneous integration, including chiplets, interposers, or advanced laminates (preferred).
  • Background in high-speed digital or mixed-signal SoCs and familiarity with aerospace, space, or high-reliability electronics (preferred).
  • Must be a U.S. person under ITAR or eligible for a federally issued export control license.

Benefits

  • Base salary of $180,000–$260,000 plus company equity.
  • Comprehensive medical, dental, and vision coverage.
  • Paid time off and paid parental leave.
  • Life insurance and additional company perks.

Interested in this position?

Apply directly on the company website

Apply Now

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